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    Chiplet互联技术综述

    Review of Chiplet Interconnection Technology

    • 摘要: 作为摩尔定律的“破局者”,Chiplet技术被业界寄予了厚望. Chiplet技术能够将多个具有特定功能的“小芯粒”通过高速互联技术组合成一个“小芯粒”集成芯片,其技术核心是能够实现芯粒组合扩展的芯粒互联技术. 从Chiplet互联协议、互联架构、典型互联芯粒、基于互联芯粒的可测性设计几个方面进行了分析与讨论. 首先详细对比分析了国内外Chiplet互联协议,给出了各协议的分层及功能. 然后介绍了3种典型的Chiplet互联架构,分析了各种架构的特点及优势. 之后介绍了Chiplet容错机制,介绍了互联接口容错编码、容错拓扑和容错路由等容错途径. 接着给出了可编程互联芯粒、路径可编程互联芯粒以及专用互联芯粒3种设计方案. 最后介绍了基于互联芯粒的可测试性设计与测试方案. 以Chiplet互联为主题,旨在帮助读者对芯粒互联技术进行系统性了解.

       

      Abstract: As the breaker of Moore’s Law, Chiplet technology has high expectations in the integrated circuit industry. Chiplet technology can combine multiple small chips with specific functions into a Chiplet integrated chip through high-speed interconnection technology, whose core technology is the Chiplet interconnection technology that can achieve Chiplet combination and expansion. This paper analyzes and discusses the Chiplet interconnection protocol, interconnection architecture, typical interconnection Chiplets, and testability design based on the interconnection Chiplet. Firstly, this paper provides a detailed comparison and analysis of domestic and foreign Chiplet interconnection protocols, and provides the layers and functions of each protocol. Secondly, this paper introduces three typical Chiplet interconnection architectures, and analyzes the characteristics and advantages of each architecture. Afterwards, the Chiplet fault-tolerant mechanism is introduced, including fault-tolerant encoding of interconnection interfaces, fault-tolerant topology, and fault-tolerant routing. Then, three types of interconnection Chiplet design schemes are presented, including programmable interconnection Chiplets, path programmable interconnection Chiplets, and fully customized interconnection Chiplets. Finally, a testability design testing scheme based on the interconnection Chiplet is introduced. This paper focuses on Chiplet interconnection and aims to help readers help readers have a systematic understanding of Chiplet interconnection technology.

       

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